Exclusive

Publication

Byline

Location

Qualcomm demos platforms scale intelligence from edge to cloud

India, Jan. 7 -- At CES 2026, Qualcomm is demonstrating how its platforms scale intelligence from edge to cloud, driving AI innovation that redefines the human experience. From next-generation wearabl... Read More


Sandisk unveils SANDISK Optimus SSD product brand @CES

India, Jan. 6 -- At the Consumer Electronics Show (CES 2026), Sandisk announced SANDISK Optimus as the new name for its renowned internal SSD lineup for gamers, creators, and professionals. The new b... Read More


NVIDIA kicks off next-generation of AI with Rubin - six new chips, one incredible AI supercomputer

India, Jan. 6 -- At CES, NVIDIA kickstarted the next-generation of AI with the launch of the NVIDIA Rubin platform, comprising six new chips designed to deliver one incredible AI supercomputer. NVIDIA... Read More


Intel Core Ultra Series 3 debut as first built on Intel 18A @CES

India, Jan. 6 -- Today, at CES, Intel unveiled Intel Core Ultra Series 3 processors, the first AI PC platform built on Intel 18A process technology that was designed and manufactured in the United Sta... Read More


NVIDIA Rubin platform, Open models, autonomous driving presents blueprint for future at CES

India, Jan. 6 -- NVIDIA founder and CEO Jensen Huang took the stage at the Fontainebleau, Las Vegas, today to open CES 2026, declaring that AI is scaling into every domain and every device. "Computin... Read More


U.S. Council: NVIDIA-Huawei AI chip gap could reach 17x by 2H27, yet H200 exports risk aiding China

India, Jan. 6 -- While Huawei's AI chips have made rapid strides, a new U.S. council report finds that NVIDIA continues to lead in overall AI hardware performance, with that lead expected to continue.... Read More


Chips JU advances quantum and semiconductor innovation with an investment over €659mn

India, Jan. 6 -- The Public Authorities Board of the Chips Joint Undertaking has retained 17 proposals for funding, supporting innovation in quantum technologies, electronic components and systems (EC... Read More


Plug, Play, Scale: The fintech advantage in India's BaaP revolution

India, Jan. 6 -- The future of banking is undergoing a significant transformation, moving beyond mere digitalization to become collaborative, modular, and driven by real-time data. A major part of thi... Read More


TSMC's bold pivot: Kumamoto Fab 2 reportedly leaps from 6nm to 2nm amid JASM losses

India, Jan. 6 -- While TSMC's Arizona expansion races ahead, its Japan operations are moving at a slower pace, drawing close attention. Plans for Kumamoto Fab 2, however, may be shifting. A Nikkei rep... Read More


Wide bandgap semiconductor market to generate USD 4.66 billion by 2032

India, Jan. 6 -- Wide bandgap semiconductor market is gaining strong momentum due to rising demand for energy-efficient power devices across electric vehicles, renewable energy systems, fast chargers,... Read More